講演情報
[336]Growth behavior of compounds due to reactive diffusion between solid Co and liquid Sn-Cu alloys
*オ ミンホ1、梶原 正憲1 (1. Tokyo Institute of Technology, Dept. Mater. Sci. Eng.)
キーワード：
reactive diffusion、intermetallic compound、Co-Sn system
Kinetics of the reactive diffusion between solid Co and liquid Sn-Cu was experimentally observed using isothermal bonding technique.