[G] Solid process/ Solid and welding process(1)

1:15 PM - 1:30 PM JST(4:15 AM - 4:30 AM UTC)

[316] Effect of Creep on Thermal Fatigue Fracture Driving Force of Power Device Die Attach Joint Using Ag Nanoparticle Sintering Joint

*Masahiro URABE¹, Yoshiharu KARIYA², Noritsuka MIZUMURA³, Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

Keywords:

Sintered nano-sized Ag particles,Creep,Die attach,Power cycle,Finite element analysis

有限要素法解析を用いて，Agナノ粒子焼結接合されたパワーデバイスダイアタッチ接合部のパワーサイクル中の熱疲労破壊駆動力におよぼすクリープの影響を検討した．