[G] Solid process/ Solid and welding process(1)

2:00 PM - 2:15 PM JST(5:00 AM - 5:15 AM UTC)

[319] Crack Growth Behavior in Fatigue Crack Networks Formation of Die Attach Joint

*Hiroshige SUGIMOTO¹, Yoshiharu KARIYA², Yoshinori YOKOYAMA³, Ryuichiro HANADA³, Shinnosuke SODA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:

Fatigue crack network,Die attach,Lead-free solder,Power module

パワーモジュールダイアタッチの疲労き裂ネットワークの寿命予測方法を検討するため，接合体試験片を用いて温度サイクル試験を行い，疲労き裂ネットワークの発達過程をき裂長さとサイクル数の関係から精査した．