Presentation Information

[384]Splitting of small-angle grain boundaries during directional solidification of silicon

*CHUANG Lu-Chung1, MAEDA Kensaku1, SHIGA Keiji1, MORITO Haruhiko1, FUJIWARA Kozo1 (1. 東北大金研)

Keywords:

Grain boundary,Directional solidification,Multicrystalline silicon

The present study shows that small-angle grain boundaries, which composed of sets of dislocations, are able to split at the crystal/melt interface of silicon under certain conditions.