講演情報
[384]Splitting of small-angle grain boundaries during directional solidification of silicon
*荘 履中1、前田 健作1、志賀 敬次1、森戸 春彦1、藤原 航三1 (1. 東北大金研)
キーワード：
Grain boundary、Directional solidification、Multicrystalline silicon
The present study shows that small-angle grain boundaries, which composed of sets of dislocations, are able to split at the crystal/melt interface of silicon under certain conditions.