Session Details

[G]Solid process/Solid and welding process

Thu. Mar 17, 2022 1:00 PM - 5:00 PM JST
Thu. Mar 17, 2022 4:00 AM - 8:00 AM UTC
Rm. G
Chair:Shinji Fukumoto(Osaka University), Tomoya NAGIRA(NIMS)
※表示の講演時間には質疑応答時間も含みます。
(質疑応答時間5分、基調講演と招待講演は5~10分)

[223]Research and Development of high-strength steels and metallurgical approaches for manufacturing processes

*Toshinobu NISHIBATA1 (1. NIPPON STEEL)

[224]Research on Shear Fatigue Strength of Advanced Multi-Material Dissimilar Lap Joint

*Hisashi SERIZAWA1, Kotaro INOSE2, Ryoji OHASHI3, Yukihiro SUGIMOTO4, Tadashi MINODA5, Toshio MURAKAMI6 (1. Osaka Univ., 2. IHI, 3. KHI, 4. Hiroshima Univ., 5. UACJ, 6. KOBELCO)

[225]Elucidation of solidification behavior of Fe-Mn-Si alloy during welding using synchrotron X-ray

*Tomoya NAGIRA1, Terumi NAKAMURA1, Fumiyoshi YOSHINAKA1, Takahiro SAWAGUCHI1, Yasuhiro AOKI2, Takayuki YAMASHITA2, Hidetoshi FUJII2 (1. NIMS, 2. JWRI Osaka Univ.)

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[226]Effect of welding conditions on texture in stir zones of friction stir welded 6%Ni carbon steel

*Takuya MIURA1, Kohsaku Ushioda1, Hidetoshi Fujii1 (1. Osaka University)

[227]Tensile properties of stir zone in friction stir welded duplex stainless steel

*Takayuki YAMASHITA1, Kohsaku USHIODA1, Hidetoshi FUJII1 (1. JWRI Osaka Univ.)

[228]Selection of Multi-interlayers for process time shortening in low-pressure Transient Liquid Phase Bonding of Ti-6Al-4V

*Ryotaro NISHI1,2, Fei Shen Ong1,2, Hirobumi Tobe2, Eiichi Sato2 (1. University of Tokyo, 2. Inst. of Space and Astronautical Science (ISAS/JAXA))

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[229]Brazing of Carbon-Carbon Fiber Composite and Stainless Steel with microwave

*Munetami UCHIBORI1, SHION YAMAZAKI1, TOSHITAKA SATUTA2, KICHI KANDA3, YASUYUKI MIWAZAWA1 (1. Tokai Univ, 2. Inst. Kanagawa Institute of Industrial Science and Technology, 3. KANTO YAKIN KOGYO CO.LTD.)

[230]Brazing of aluminum and graphite

*Shion YAMAZAKI1, mikiaki YOSHINO1, yasuyuki MIYAZAWA1 (1. Tokai university)

[231]Fabrication of new brazing filler metal by mechanical alloying

*MANA SAKAI1, Hiroaki Hara1, Atsuya Kato1, Yasuyuki Miyazawa2 (1. 東海大工(院生)、2. 東海大工)

[232]Coating Film Behavior at Heating of Traditional Gold Leaf and Bonding Gold Wire

*Osamu OHASHI1, Takashi HARUMOTO2, Konomi IKita3, Kenichi Tsutsumi3, Hiroshi Onodera3, Takashi Kimura4, Kensaku Aihara5, Hidetoshi Namiki5 (1. WELLBOND, 2. Tokyo Institute of Technology, 3. JEOL, 4. NIMS, 5. Tokyo Univ. of Arts)

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[233]Bonding of Copper by Liquid Phase Infiltration into Porous Metals

*Shinji FUKUMOTO1, Ryota YAGANE1, Michiya MATSUSHIMA1 (1. Graduate school of Engineering, Osaka Univ.)

[234]Cu-Cu Joining using Low-Temperature Sintering of Nanostructured Cu Plating Film

*Soichiro NAKAJIMA1, Mitsuhiro AIZAWA3, Kiyoshi OI3, Masaomi HORITA2, Masahiro SHIMIZU2, Susumu ARAI2 (1. Faculty of Engineering Shinshu Univ. (Bachelor), 2. Faculty of Engineering Shinshu Univ., 3. Shinko Electric Industries Co., Ltd.)

[235]Formation of highly strong Ag/SiO2 interface using Ag-Ag2O composite sinter material

*Tomoki MATSUDA1, Ryotaro Seo1, Akio Hirose1 (1. Osaka University)