Presentation Information
[251]Enhancing bonding stability between Cu2O oxide layer and pure copper by low-gas pressure oxidation
*Seung Zeon Han1, Eun-Ae Choi1 (1. Korea Institute of Materials and Science)
Keywords:
Oxide coating,Interface,Low pressure oxidation,Pure copper,Cu2O
When copper was heat-treated under extremely low air pressure, minimizing oxygen availability. This process successfully formed a visually appealing, robust, and adhesive oxide layer on copper.
Comment
To browse or post comments, you must log in.Log in