Presentation Information

[251]Enhancing bonding stability between Cu2O oxide layer and pure copper by low-gas pressure oxidation

*Seung Zeon Han1, Eun-Ae Choi1 (1. Korea Institute of Materials and Science)

Keywords:

Oxide coating,Interface,Low pressure oxidation,Pure copper,Cu2O

When copper was heat-treated under extremely low air pressure, minimizing oxygen availability. This process successfully formed a visually appealing, robust, and adhesive oxide layer on copper.

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