講演情報
[251]Enhancing bonding stability between Cu2O oxide layer and pure copper by low-gas pressure oxidation
*韓 承傳1、崔 恩愛1 (1. 韓國材料硏究阮)
キーワード：
Oxide coating、Interface、Low pressure oxidation、Pure copper、Cu2O
When copper was heat-treated under extremely low air pressure, minimizing oxygen availability. This process successfully formed a visually appealing, robust, and adhesive oxide layer on copper.