Presentation Information

[IS1]Transforming Bending Tests into High-Throughput Mechanical Characterization through DIC-Based Augmentation

○Praveen Kumar Kumar1 (1. Indian Institute of Science)

Keywords:

Creep,High Throughput Testing,Digital Image Correlation,Bending

We integrate digital image correlation with cantilever bending to map local strain fields and extract multiple stress–strain–strain-rate data from a single test. The method enables high-throughput mechanical characterization, reduces material and testing time, and supports scalable industry deployment.

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