[IS] IS1.Frontiers in Structural Materials Research through Advanced Measurement Techniques

9:05 〜 9:35

[IS1] Transforming Bending Tests into High-Throughput Mechanical Characterization through DIC-Based Augmentation

○Praveen Kumar Kumar¹ (1. Indian Institute of Science)

キーワード：

Creep、High Throughput Testing、Digital Image Correlation、Bending

We integrate digital image correlation with cantilever bending to map local strain fields and extract multiple stress–strain–strain-rate data from a single test. The method enables high-throughput mechanical characterization, reduces material and testing time, and supports scalable industry deployment.