Presentation Information

[P96]Effect of Electric Assist Conditions on Direct Cu/Si Bonding

○Rui Hatayama1, Shinji Koyama1 (1. Gunma Univ.)

Keywords:

Cu,Si,Electric Assist,Current Value,Direct Bonding

We investigate the effects of electro-assisted bonding conditions on Cu/Si solid-state diffusion bonding and explore ways to improve bond strength.

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