Presentation Information
[P108]Influence of Layer Structure on the Electrical Resistivity of Cu/Nb Laminated Composites
○Wenyue Yang1, Takayuki Shiraiwa1 (1. UTokyo)
Keywords:
Laminated Composites,Electrical Resistivity,Numerical simulation,Diffusion bonding
In this study, Cu/Nb laminates were fabricated to investigate the effect of diffusion bonding on the electrical resistivity. Numerical simulations were performed to calculate resistivity as a function of layer thickness, taking into account the effects of both interfaces and grain boundaries.
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