[P] 第8分野　構造材料　P114～P135

[P108] Cu/Nb積層材料の電気抵抗率に対する層構造の影響

○楊 文越¹、白岩 隆行¹ (1. 東京大学)

キーワード：

積層材料、電気抵抗率、数値シミュレーション、拡散接合

In this study, Cu/Nb laminates were fabricated to investigate the effect of diffusion bonding on the electrical resistivity. Numerical simulations were performed to calculate resistivity as a function of layer thickness, taking into account the effects of both interfaces and grain boundaries.