[22p-C501-1~12] 22.1 Joint Session M "Phonon Engineering"

4:00 PM - 4:15 PM JST(7:00 AM - 7:15 AM UTC)English Presentation

[22p-C501-9] Liquid cooling and subcooled flow boiling in manifold microchannel for electronics cooling

〇(D)Hongyuan SHI¹, Simon GRALL^1,2, Ryoto YANAGISAWA¹, Laurent JALABERT^1,2, Soo Hyeon KIM¹, Masahiro NOMURA^1,2 (1.IIS Univ. of Tokyo, 2.LIMMS-CNRS Univ. of Tokyo)

Keywords:

Electrionic cooling,flow boiling,manifold microchannel

Thermal management is one of the most important techniques for the development of advanced electronics. Traditional cooling solutions, like fans and fins, hardly overcome the heat dissipation challenges posed by device miniaturization and higher power density. However, embedded microfluidic cooling can shorten the distance between coolant and heat source by directly etching microchannel in the substrate to greatly improve the cooling performance. Here we investigated the heat transfer and friction features of liquid water in the manifold microchannel (MMC) under various heat flux conditions. The traditional microchannel (MC) was used as a reference to compare the cooling performance. In addition, the subcooled flow boiling in manifold microchannel was also studied.