[16p-C43-1~12] 1.5 Instrumentation, measurement and Metrology

1:15 PM - 1:30 PM JST(4:15 AM - 4:30 AM UTC)

[16p-C43-2] Development of Depth Estimation Technique for Micro Defects in Substrates

〇Daichi Yamaura¹, Yoshitaro Sakata¹, Nao Terasaki¹ (1.National Institute of Advanced Industrial Science and Technology)

Keywords:

semiconductor,detection technique,subsurface defect

In semiconductor processes, there are defects formed in wafers that are difficult to detect by conventional microscopy because they exist within the substrate. These defects are known as subsurface defects (microcracks). While methods for detecting subsurface defects have been reported, no methods have been reported for measuring their depth with high precision and speed. In this study, we report the results of our investigation into a method for analyzing the depth of defects formed in glass substrates using only images captured near the surface.