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Mon. Sep 16, 2024

Tue. Sep 17, 2024

Wed. Sep 18, 2024

Thu. Sep 19, 2024

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Presentation by Applicant for JSAP Young Scientists Presentation Award

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The embodied environmental impact of integrated circuit manufacturing

Symposium Sponsor<br><a title="RESONAC" href="https://www.resonac.com/" target="_blank" rel="noopener"><img src="https://meeting.jsap.or.jp/jsapm/wp-content/uploads/2024/07/T19_Resonac.jpg" alt="RESONAC" width="184" height="40" /></a>

Materials for Green & Sustainable Semiconductor Manufacturing

The 85th JSAP Autumn Meeting 2024

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[17p-C302-8]The embodied environmental impact of integrated circuit manufacturing

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