[17p-C41-1~11] Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

3:30 PM - 4:00 PM JST(6:30 AM - 7:00 AM UTC)

[17p-C41-6] Direct bonding of dissimilar materials using atmospheric pressure non-equilibrium plasma jet

〇Kosuke Takenaka¹, Gichiro Uchida², Yuichi Setsuhara¹ (1.Osaka Univ., 2.Meijo Univ.)

Keywords:

dissimilar materials bonding