The 85th JSAP Autumn Meeting 2024
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Session Details

Symposium (Oral)Symposium : Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

[17p-C41-1~11]Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

Tue. Sep 17, 2024 1:30 PM - 7:00 PM JST
Tue. Sep 17, 2024 4:30 AM - 10:00 AM UTC
C41 (Hotel Nikko 4F)
Kenji Ishikawa(Nagoya Univ.), Atsushi Tanide(SCREEN), Ryo Hiramatsu(Western Digital)
1:30 PM - 1:35 PM JST(4:30 AM - 4:35 AM UTC)

[17p-C41-1]opening

〇Hiromasa Tanaka1 (1.Nagoya Univ.)
Comment()
1:35 PM - 2:05 PM JST(4:35 AM - 5:05 AM UTC)

[17p-C41-2]Wafer Bonding Assisted by Plasma Surface Activation and its Application

〇Kenji Takahashi1 (1.AIST)
Comment()
2:05 PM - 2:35 PM JST(5:05 AM - 5:35 AM UTC)

[17p-C41-3]Mechanism of surface activated bonding

〇Tadatomo Suga1,2 (1.The University of Tokyo, 2.Meisei University)
Comment()
2:35 PM - 2:50 PM JST(5:35 AM - 5:50 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[17p-C41-4]Interfacial Characterization of Novel Bonding Dielectric Films for 3D Integration

〇Hayato Kitagawa1, Ryosuke Sato1, Fumihiro Inoue1 (1.YOKOHAMA National Univ.)
Comment()
3:00 PM - 3:30 PM JST(6:00 AM - 6:30 AM UTC)

[17p-C41-5]Fast Atom Beam Source for Large-Diameter Wafer Bonding

〇Seiichi Hata1 (1.Nagoya Univ)
Comment()
3:30 PM - 4:00 PM JST(6:30 AM - 7:00 AM UTC)

[17p-C41-6]Direct bonding of dissimilar materials using atmospheric pressure non-equilibrium plasma jet

〇Kosuke Takenaka1, Gichiro Uchida2, Yuichi Setsuhara1 (1.Osaka Univ., 2.Meijo Univ.)
Comment()
4:00 PM - 4:30 PM JST(7:00 AM - 7:30 AM UTC)

[17p-C41-7]Power Device Bonding Technology

〇Jianbo Liang1, Ohno Yutaka2, Koji Inoue2, Yasuyoshi Nagai2, Naoteru Shigekawa1 (1.Osaka Metropolitan Univ., 2.IMR Tohoku Univ.)
Comment()
4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[17p-C41-8]GaN HEMTs on 1-inch polycrystalline diamond wafers

〇Chiharu Moriyama1, Keisuke Kawamura2, Sumito Ouchi2, Hiroki Uratani2, Yutaka Ohno3, Koji Inoue3, Yasuyoshi Nagai3, Naoteru Shigekawa1, Jianbo Liang1 (1.Osaka Metropolitan Univ., 2.Air Water inc., 3.IMR Tohoku Univ.)
Comment()
4:55 PM - 5:25 PM JST(7:55 AM - 8:25 AM UTC)

[17p-C41-9]Flexible direct bonding method for the fabricating flexible electronics system

〇Masahito Takakuwa1,2 (1.The University of Tokyo, 2.RIKEN)
Comment()
5:25 PM - 5:55 PM JST(8:25 AM - 8:55 AM UTC)

[17p-C41-10]Application of surface activated bonding to photonic devices

〇Eiji Higurashi1 (1.Tohoku Univ.)
Comment()
6:00 PM - 7:00 PM JST(9:00 AM - 10:00 AM UTC)

[17p-C41-11]Panel discussion

〇Atsushi Tanide1,2, Hiromasa Tanaka2, Kenji Ishikawa2, Kenji Takahashi3, Tadatomo Suga4, Masahito Takakuwa4, Seiichi Hata5, Kosuke Takenaka6, Jianbo Liang7, Eiji Higurashi8 (1.SCREEN HD, 2.Nagoya Univ. cLPS, 3.AIST, 4.Tokyo Univ., 5.Nagoya Univ., 6.Osaka Univ., 7.Osaka Metropolitan Univ., 8.Tohoku Univ.)
Comment()
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