[19p-A37-1~15] 3.7 Optical measurement, instrumentation, and sensor

4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[19p-A37-11] Dynamic vibrational analysis in laser inspection of semiconductor chips

〇(M1)Reo Terauchi¹, Katsuhiro Mikami¹, Kenichi Ikeda², Yusuke Nakaminami², Masanori Otake² (1.Kindai Univ., 2.Opto Systems Co.LTD.)

Keywords:

Semiconductor Chip,Laser Doppler Vibrometer,Simulation Analysis

We have previously reported on a technique for inspecting small semiconductor chips for breakage by combining laser-induced elastic waves with principal component analysis using a laser Doppler vibrometer. The results show that the frequency components useful for rupture inspection can be tuned by the chip mounting foundation.In this study, a simulation model of the previous study was created using MATLAB/Simulink, and the results of the previous study were verified by analyzing the vibration dynamics during the installation of the foundation.