[19p-D62-1~17] 22.1 Joint Session M "Phonon Engineering"

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[19p-D62-5] Validation and Application of Thermoreflectance and Gibbs Excess Methods

〇Ryohei Nagahiro¹, Kosuke Maeda¹, Eleonora Issota², Shizhou Jiang², G. Jeffrey Snyder², Oluwaseyi Balogun², Junichiro Shiomi¹ (1.Univ. Tokyo, 2.Northwestern Univ.)

Keywords:

Thermal boundary resistance,Thermal conductivity,Thermoreflectance

The grain boundaries or interfaces in polycrystalline materials significantly reduce thermal conductivity due to phonon scattering. In this context, thermal boundary resistance (TBR) is crucial for understanding the thermal transport properties of materials. This study provides comparition and validation of the TBR obtained from the same interface using thermoreflectance methods and Gibbs Excess methods by fabricating a homogeneous silicon interface via surface-activated bonding. Additionally, the application of TBR measurement for polycrystalline silicon interfaces created by spark plasma sintering will be presented.