[20a-A23-1~5] Vibronics: Energy transport science of vibrations in solid

10:50 AM - 11:20 AM JST(1:50 AM - 2:20 AM UTC)English Presentation

[20a-A23-4] Elucidating the Correlation between Thermal Conductivity and Nanoscale Structures through Topological Data Analysis

〇Emi Minamitani¹ (1.SANKEN, Osaka Univ.)

Keywords:

Topological Data Analysis,amorphous,Thermal conductivity

We have shown that the thermal conductivity can be predicted by quantifying the atomic connections, ring structures, and voids in amorphous Si using persistent homology. Furthermore, inverse analysis allows discussion of the relationship between local structures, medium-range order, and thermal conductivity. In this presentation, we will introduce this research and discuss the potential for elucidating the correlation between nanoscale structures and thermal conductivity by combining topological data analysis with physical property simulations.