講演情報
[20a-A23-4]Elucidating the Correlation between Thermal Conductivity and Nanoscale Structures through Topological Data Analysis
〇Emi Minamitani1 (1.SANKEN, Osaka Univ.)
キーワード:
Topological Data Analysis、amorphous、Thermal conductivity
We have shown that the thermal conductivity can be predicted by quantifying the atomic connections, ring structures, and voids in amorphous Si using persistent homology. Furthermore, inverse analysis allows discussion of the relationship between local structures, medium-range order, and thermal conductivity. In this presentation, we will introduce this research and discuss the potential for elucidating the correlation between nanoscale structures and thermal conductivity by combining topological data analysis with physical property simulations.
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