The 85th JSAP Autumn Meeting 2024

Symposium : Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

Symposium (Oral)

[17p-C41-1~11]Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

Tue. Sep 17, 2024 1:30 PM - 7:00 PM JST
Tue. Sep 17, 2024 4:30 AM - 10:00 AM UTC

C41 (Hotel Nikko 4F)

Kenji Ishikawa(Nagoya Univ.), Atsushi Tanide(SCREEN), Ryo Hiramatsu(Western Digital)

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