Presentation Information

[22p-P03-21]Effects of Flexible Substrate for Bonding Fabrication of Perovskite Solar Cells Using Copper Iodide Hole Transport Layer through Hot-Pressing Method

〇(M2)Auttaphon Ploypradit1, Koji Tomita1, Masao Isomura1, Tetsuya Kaneko1 (1.Tokai Univ.)

Keywords:

Perovskite Solar Cells,Copper iodide HTL,Bonding Fabrication

Perovskite solar cells (PSCs) are under extensive research due to their high conversion efficiency. However, when water-based solutions or plasma deposition methods are employed for fabricating PSCs, depositing carrier transport layers directly onto the perovskite layer can sometimes pose a challenge. A bonding technique is one of the promising methods to address this issue. This research studies the effects of flexible substrates in hot-pressing for bonding fabrication of PSCs, using the substrates of solid and flexible substrate pairs.
The PSCs' current density-voltage (J-V) characteristics with the procedure completed are presented. The current flow observed in the cell with the flexible substrate compared to the cell with glass substrates. The electrical connection is created because the flexible substrate easily conforms to the shape of the bonding surface during hot pressing. Unfortunately, even with flexible substrate bonding, the J-V characteristic exhibits a linear trend, indicating that solar cell operation has not been achieved. In the presentation, we will also discuss the details and ways to improve it.