Presentation Information

[23a-1BM-8]Fabrication and Evaluation of Process-friendly 3D-stacked Retinal Prosthesis Chip

〇Ryohei Kishimoto1, Ryotaro Bamba2, Yushi Kato3, Ryosuke Katsurai3, Hisashi Kino4, Takafumi Fukushima1,2, Tetsu Tanaka1,2 (1.Graduate School of Engineering, Tohoku Univ., 2.Graduate School of Biomedical Engineering, Tohoku Univ., 3.School of Engineering, Tohoku Univ., 4.Graduate School of ISEE, Kyushu Univ.)

Keywords:

semiconductor