Presentation Information

[9p-N404-13]Bonding interface analysis of In/Nb bumps for fabrication of 3D superconducting circuits

〇Shoei Ishiyama1, Yuuki Araga2, Hiroshi Nakagawa2, Katsuya Kikuchi2, Tohru Taino1 (1.Saitama Univ., 2.AIST)

Keywords:

Superconducting Devices,Room temperature bonding