[11a-A24-1~13] 3.6 Laser processing

9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)

[11a-A24-3] Relationship Between Crack Formation and Thermal Effects in Direct Laser Processing of Glass

〇Toshio Otsu¹, Tsubasa Endo¹, Hiroharu Tamaru¹, Yohei Kobayashi¹ (1.University of Tokyo)

Keywords:

glass,Ultrafast pulse laser

Crack-free, high-quality hole formation is required for glass substrates. In this study, we investigated glass drilling by direct laser processing and confirmed a correlation between the number of cracks and thermal effects. The underlying mechanism will be discussed based on temperature simulations inside the glass.