Presentation Information
[11a-N101-8]A Novel Bonding Technology between microLEDs on EGOS (ELO GaN on Sapphire) Substrate and Au micro-bump on Silicon
〇Akiko Komoda1, Sooyoung Moon1, Yuichiro Hayashi1, Yoshinobu Kawaguchi1, Keisuke Kawamura1, Takeshi Kamikawa1 (1.KYOCERA Corporation)
Keywords:
microLED,Au bump,bonding
