Presentation Information
[11p-A31-8]Interfacial Adhesion Evaluation of Ti Films on Substrates Using High-Residual-Stress DLC Film
〇(M1)Atsuki Nakada1, Hiroyuki Kousaka1, Tamio Iida2, Hitoe Habuchi2, Yu Miyauchi3, Toshihiro Hohsen3, Artit Chingsungnoen4, Phitsanu Poolcharuansin4, Kyohei Yoshikawa5, Jun Sakai5, Yuma Ito5, Masaru Hori6, Toru Harigai1 (1.GIfu Univ., 2.NIT, Gifu College, 3.RHESCA, 4.MSU, 5.IBIDEN, 6.Nagoya Univ.)
Keywords:
DLC,Adhesion,Residual stress
A method for evaluating the adhesion of the Ti/substrate interface using a high-residual-stress diamond-like carbon (DLC) film is proposed. A DLC film was deposited on a Ti film by plasma-enhanced chemical vapor deposition (plasma CVD), and the residual stress of the DLC film was used to induce delamination at the Ti/substrate interface. The film force of the DLC at the onset of delamination was used as an indicator of interfacial adhesion. SUJ2 steel was used as the substrate. The Ti film deposited by RF magnetron sputtering (RFMS) delaminated from the substrate at a DLC thickness of 0.5 μm, corresponding to a film force of 7.75 N/cm. In contrast, the Ti film deposited by high-power impulse magnetron sputtering (HiPIMS) did not delaminate even at a DLC thickness of 4 μm. These results demonstrate the effectiveness of the proposed method for evaluating the adhesion of the Ti/substrate interface.