Presentation Information
[11p-E217-5]Fe-Cu-Ag composite micro/nano powders with core-shell microstructures prepared by gas-atomization and induction thermal plasma
〇Kwangjae Park1, Zheng Liu1, Yusuke Hirayama1, Hansang Kwon2 (1.AIST, 2.Pukyong National Univ.)
Keywords:
semiconductor test socket,composite materials,core-shell
The final inspection stage in semiconductor manufacturing is critical for ensuring device quality, where test sockets must maintain high reliability, durability, and electrical conductivity under repeated use. Conventional gold-coated Ni powders provide good performance but suffer from high cost and limited lifespan due to coating delamination, especially as high-performance devices such as HBM continue to evolve. In this study, Fe–Cu–Ag composite powders were synthesized via gas atomization and thermal plasma processes. Micro-sized powders exhibited a unique multilayer core–shell structure (Fe core/Cu interlayer/Ag shell) driven by immiscibility and melting point differences, achieving a high electrical conductivity of 2696 S/cm, significantly exceeding that of Ni powders. Additionally, nanosized powders with Fe cores and Cu–Ag shells were formed via vapor pressure differences in the plasma process. These results demonstrate that immiscible metallic systems can be engineered into high-performance composite structures through advanced process control.