[8p-B21-1~10] (Public Symposium) Advanced Logic Semiconductors: From Si-GAA to CFET and Beyond

4:50 PM - 5:20 PM JST(7:50 AM - 8:20 AM UTC)

[8p-B21-8] Recent Trends in Optoelectronic Integration Packaging Technologies and Their Expanding Applications

〇KOICHI TAKEMURA¹ (1.AIO Core)

Keywords:

packaging,optical transceiver,silicon photonics

The rapid progress of AI/ML has led to a significant increase in data traffic and power consumption in data centers. As a result, optoelectronic integration packaging technologies that shorten the electrical interconnects between LSIs and optical transceivers have attracted considerable attention. This presentation reviews recent domestic and international technology trends, with a focus on Co-Packaged Optics (CPO) for switch ASICs. In addition, the features of the developed ultra-compact silicon photonics optical transceiver and its potential applications beyond switch ASICs are discussed.