[8p-C309-1~16] 12.7 Biomedical Engineering and Biochips

3:00 PM - 3:15 PM JST(6:00 AM - 6:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[8p-C309-5] Analysis of Thermal Deformation and Evaluation of Mitigation Methods in Thin Foundry Chips for 3D Integration

〇Sota Koyama¹, Yuki Sakamoto¹, Hiroki Nakamura¹, Shoma Okamura³, Takafumi Fukushima^1,2, Tetsu Tanaka^1,2 (1.Graduate School of Eng., Tohoku Univ., 2.Graduate School of Biomedical Eng., Tohoku Univ., 3.School of Eng. Tohoku Univ.)

Keywords:

MCtW,foundry chip,warpage