[8p-S2-1~11] Innovating Photonics-Electronics Convergence Technologies for AI Data Centers: Systems, Devices, Materials, and Integration Processes

2:30 PM - 3:00 PM JST(5:30 AM - 6:00 AM UTC)

[8p-S2-5] Advanced Microelectronic Packaging for Photonic–Electronic Co-Integration

〇Takafumi Fukushima¹ (1.Tohoku Univ.)

Keywords:

Semiconductor,Packaging,Photonic-Electronic Co-Integration

This talk provides an overview of the latest trends in 3D packaging, whose importance is rapidly increasing as a key enabling technology that strongly influences the performance of integrated circuits. It also introduces research activities at Tohoku University related to chiplets and heterogeneous integration. Furthermore, recent efforts on Co-Packaged Optics (CPO), as a fundamental technology supporting the emerging field of photonic–electronic integration, will be discussed.