Presentation Information

[9a-A24-2]Fabrication of Micro Cone Shaped Al Bumps Fabricated By Nanoparticle Deposition Method

〇Takumi Shimada1,2, Yuuki Araga2, Hiroshi Nakagawa2, Katsuya Kikuchi2, Toru Taino1 (1.Saitama Univ., 2.AIST)

Keywords:

superconductivity,3D integration,bump


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