Presentation Information
[9a-A24-2]Fabrication of Micro Cone Shaped Al Bumps Fabricated By Nanoparticle Deposition Method
〇Takumi Shimada1,2, Yuuki Araga2, Hiroshi Nakagawa2, Katsuya Kikuchi2, Toru Taino1 (1.Saitama Univ., 2.AIST)
Keywords:
superconductivity,3D integration,bump
