[9a-B12-1~10] 12.3 Functional Materials and Novel Devices

9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[9a-B12-2] Damage-free Interconnection Technology Enabled by Ultrathin, Highly Stretchable, and Gas-Permeable Anisotropic Conductive Film

〇Shumpei Katayama^1,2, Lulu Sun¹, Tomoki Shigehara^1,2, Daishi Inoue¹, Daisuke Hashizume¹, Shinjiro Umezu², Kenjiro Fukuda^1,3, Sunghoon Lee^1,4, Takao Someya^1,4 (1.RIKEN, 2.Waseda Univ., 3.Osaka Univ., 4.UTokyo)

Keywords:

Anisotropic conductive film (ACF),Stretchable electronics,Interconnection technology

As stretchable electronics advance, the importance of device-to-device interconnection technology is increasing. This requires extremely thin structures, high stretchability, gas permeability, and damage-free bonding processes. However, conventional anisotropic conductive films (ACFs) struggle to satisfy these multiple requirements simultaneously, which has limited their range of application. In this study, we developed an ultrathin ACF with high stretchability and gas permeability, and realized a damage-free interconnection technology using a non-heating, pressure-free process.