Presentation Information
[9p-E219-6][JSAP-Optica Joint Symposia Invited Talk] Accelerating Heterogeneous Integration via CFB Technology:
Contributing to AI Data Centers through Open Innovation
〇Kenichi Tanigawa1, Takahito Suzuki1, Hironori Furuta1, Hiroyuki Takahashi1, Nobuhiko Nishiyama2 (1.Oki Electric Industry Co., Ltd.,, 2.Science Tokyo)
Keywords:
Heterogeneous integration,InP,Silicon Photonics
Crystal Film Bonding (CFB) is a heterogeneous integration technology that separates functional layers of compound semiconductors and bonds them onto substrates of different materials. Since mass production began in 2006, this technology has achieved a track record of bonding over 200 billion AlGaAs-based micro-LEDs. In this presentation, we outline the CFB technology and its mass production history, alongside "Tiling Technology" which enables wafer-size conversion. Furthermore, as case studies of open innovation, we introduce techniques to relax bonding alignment tolerances between silicon and III-V waveguides in photonic devices, as well as application examples to InP-based devices. Finally, we discuss a wider range of applications in fields such as power devices.