講演情報
[9p-E219-6][JSAP-Optica Joint Symposia Invited Talk] Accelerating Heterogeneous Integration via CFB Technology:
Contributing to AI Data Centers through Open Innovation
〇Kenichi Tanigawa1, Takahito Suzuki1, Hironori Furuta1, Hiroyuki Takahashi1, Nobuhiko Nishiyama2 (1.Oki Electric Industry Co., Ltd.,, 2.Science Tokyo)
キーワード：
Heterogeneous integration、InP、Silicon Photonics
Crystal Film Bonding (CFB) is a heterogeneous integration technology that separates functional layers of compound semiconductors and bonds them onto substrates of different materials. Since mass production began in 2006, this technology has achieved a track record of bonding over 200 billion AlGaAs-based micro-LEDs. In this presentation, we outline the CFB technology and its mass production history, alongside "Tiling Technology" which enables wafer-size conversion. Furthermore, as case studies of open innovation, we introduce techniques to relax bonding alignment tolerances between silicon and III-V waveguides in photonic devices, as well as application examples to InP-based devices. Finally, we discuss a wider range of applications in fields such as power devices.