[18a-W9_323-1~10] CS.7 Code-sharing Session of 6.5 & 7.5

10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[18a-W9_323-7] Characterization of Chemical Bonding Features at the Ti/Silica-Filled Epoxy Resin Interface

〇Yuki Imai¹, Kotaro Ozaki¹, Ibuki Saburi¹, Katsunori Makihara^1,2 (1.Nagoya Univ. Eng., 2.IHP)

Keywords:

Ti,Silica-Filled Epoxy Resin,Chemical Bonding Features