Poster Session 1

Student presentation

[P-12] Ultrashort pulsed laser drilling of through-glass vias for glass core packaging

*Daniel Franz¹, David Schuster¹, Simon Schwarz¹, Stefan Rung², Cemal Esen³, Ralf Hellmann¹ (1. University of Applied Sciences Aschaffenburg (Germany), 2. Schmoll Maschinen GmbH (Germany), 3. Ruhr University Bochum (Germany))

Keywords:

Ultra-short pulsed laser,Laser drilling,Through-glass vias (TGV),Borofloat 33 glass

C000031