Joint Session(3:10 PM - 4:40 PM JST)
LPM & HPL Joint Session: Laser Processing in Energy Innovation
Joint Session : Joint Session
LPM Oral Presentation(8:30 AM - 10:10 AM JST)
LPM 28: Surface Processing 1
LPM : LPM 28
LPM Oral Presentation(10:40 AM - 12:20 PM JST)
LPM 31: Surfece Processing 2
LPM : LPM 31
LPM Oral Presentation(1:20 PM - 2:50 PM JST)
LPM 34: Beam Shaping 2
LPM : LPM 34
LPM Oral Presentation(8:30 AM - 10:10 AM JST)
LPM 29: Additive Processes
LPM : LPM 29
LPM Oral Presentation(10:40 AM - 12:20 PM JST)
LPM 32: Surface Texturing
LPM : LPM 32
LPM Oral Presentation(1:30 PM - 2:50 PM JST)
LPM 35: Novel Systems and Processes
LPM : LPM 35
LPM Oral Presentation(8:30 AM - 10:10 AM JST)
LPM 30: LPM Special Session 2: Ultrashort Pulse Laser Processing of Transparent Materials (2-2)
LPM : LPM 30
LPM Oral Presentation(10:40 AM - 12:30 PM JST)
LPM 33: LPM Special Session 2: Ultrashort Pulse Laser Processing of Transparent Materials (2-3)
LPM : LPM 33
LPM Oral Presentation(1:30 PM - 2:50 PM JST)
LPM 36: Micro-machining
LPM : LPM 36
HPL Oral Presentation(8:30 AM - 10:20 AM JST)
HPL 10: Welding 2
HPL : HPL 10
HPL Oral Presentation(10:40 AM - 12:30 PM JST)
HPL 11: Process Monitoring and Control
HPL : HPL 11
HPL Oral Presentation(1:20 PM - 2:50 PM JST)
HPL 12: Surface Modification
HPL : HPL 12