Joint Session(3:10 PM - 4:40 PM JST)
LPM & HPL Joint Session: Laser Processing in Energy Innovation
Chair:Yongfeng Lu(University of Nebraska‐Lincoln, USA)
Joint Session : Joint Session
LPM Oral Presentation(8:30 AM - 10:10 AM JST)
LPM 28: Surface Processing 1
Chair:Duncan P. Hand(Heriot-Watt University, UK)
LPM : LPM 28
LPM Oral Presentation(10:40 AM - 12:00 PM JST)
LPM 31: Surfece Processing 2
Chair:Shigeki Matsuo(Shibaura Institute of Technology, Japan)
LPM : LPM 31
LPM Oral Presentation(1:20 PM - 2:50 PM JST)
LPM 34: Beam Shaping 2
Chair:Niclase-Felix Sima(National Institute for Laser, Plasma and Radiation Physics, Romania)
LPM : LPM 34
LPM Oral Presentation(8:30 AM - 10:10 AM JST)
LPM 29: Additive Processes
Chair:Myong Yong Choi(Gyeongsang National University, Korea)
LPM : LPM 29
LPM Oral Presentation(10:40 AM - 12:20 PM JST)
LPM 32: Surface Texturing
Chair:Andrés Fabian Lasagni(Technische Universität Dresden, Fraunhofer IWS, Germany)
LPM : LPM 32
LPM Oral Presentation(1:30 PM - 2:50 PM JST)
LPM 35: Novel Systems and Processes
Chair:Jean-Philippe Colombier(Jean Monnet University, France)
LPM : LPM 35
LPM Oral Presentation(8:30 AM - 10:10 AM JST)
LPM 30: LPM Special Session 2: Ultrashort Pulse Laser Processing of Transparent Materials (2-2)
Chair:Paulius Gecys(Center for Physical Sciences and Technology (FTMC), Lithuania)
LPM : LPM 30
LPM Oral Presentation(10:40 AM - 12:30 PM JST)
LPM 33: LPM Special Session 2: Ultrashort Pulse Laser Processing of Transparent Materials (2-3)
Chair:Razvan Stoian(Université Jean Monnet, France)
LPM : LPM 33
LPM Oral Presentation(1:30 PM - 2:50 PM JST)
LPM 36: Micro-machining
Chair:Mizue Mizoshiri(Nagaoka University of Technology, Japan)
LPM : LPM 36
HPL Oral Presentation(8:30 AM - 10:00 AM JST)
HPL 10: Welding 2
Chair:Jörg Volpp(University West, Sweden)
HPL : HPL 10
HPL Oral Presentation(10:40 AM - 12:30 PM JST)
HPL 11: Process Monitoring and Control
Chair:Takashi Kayahara(Furukawa Electric Co., Ltd., Japan)
HPL : HPL 11
HPL Oral Presentation(1:30 PM - 2:40 PM JST)
HPL 12: Surface Modification
Chair:Keisuke Takenaka(Joining and Welding Research Institute, Osaka University, Japan)
HPL : HPL 12