The 9th International Congress on Laser Advanced Materials Processing (LAMP2025)
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Presentation Information

10:50 AM - 11:10 AM JST(1:50 AM - 2:10 AM UTC)Student presentation

[27-02]Photonic wire bonding using world’s highest refractive index UV curable resin for dip-in 3D laser lithography

*Lixin Xiang1, Sho Okada2, Katsunori Nishiura3, Takuo Shikama3, Shu Nagamatsu1, Towa Maekawa1, Kensuke Otsuka3, Tomohiro Amemiya1 (1. Institute of Science Tokyo (Japan), 2. National Institute of Information and Communications Technology (Japan), 3. Mitsui Chemicals, Inc. (Japan))

Keywords:

3D laser lithography,photonic wire bonding,high-index resin

C000116
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