Presentation Information
[P-88]Investigation of laser debonding behaviour for advanced semiconductor packaging
*Insung Choi1, Sungwon Mo2, Seunghoon Lee2, Xuan-Bach Le3, Sung-Hoon Choa3 (1. Korea Institute of Machinery and Materials (Korea), 2. ZEUS Co., Ltd (Korea), 3. Seoul National University of Science and Technology (Korea))
Keywords:
laser debonding,advanced semiconductor packaging
C000213