LPM 35: Novel Systems and Processes

2:10 PM - 2:30 PM JST(5:10 AM - 5:30 AM UTC)

[47-03] Drilling of Through-Glass Vias (TGVs) using femtosecond GHz Burst Modes and Selective Laser Etching

Simas Butkus^1,2, *Kamile Kasaciunaite¹, Mykolas Karpavicius¹, Domas Baliukonis¹ (1. Light Conversion, UAB (Lithuania), 2. Vilnius University (Lithuania))

Keywords:

GHz,femtosecond,TGV,etching,through-glass via

C000058