Presentation Information
[1P-497]Development of a novel lifespan evaluation method using budding yeast
○Kyosuke Hagiri1, Yoshika Hosono2, Masahiko Harata1, Chihiro Horigome1 (1. Tohoku University Graduate School of Agricultural Science, 2. Tohoku University Faculty of Agriculture)
Password required to view
orLog in
Comment
To browse or post comments, you must log in.Log in