[H1-P301] Poster 301

[H1-P301-04] Copper Thin Film Formation by Mist CVD for Next-Generation Electronic Devices: Structural Control and Surface Planarization

*Tatsuki Okada¹, Ryousuke Ohashi¹, Htet Su Wai², Toshiyuki Kawaharamura^1,2 (1. KUT (Japan), 2. RI, KUT (Japan))

Keywords:

Copper,Mist Chemical Vapor Deposition,Surface Roughness