[WG2] Hybrid Integration I

12:00 PM - 12:15 PM JST(3:00 AM - 3:15 AM UTC)

[WG2-4] Micro-machined Silicon for VCSEL-Based Transmitter with Direct RF Interfaces

Jinsheng Xu¹, ○Yueqi Zhao¹, Zhenzhen Wang¹, Chuanzhi Wang¹, Jia Li¹, Qian Zhang¹, Qingwei Mo³, Chenhui Li^1,2 (¹Zhejiang Lab, ²Zhejiang Univ., ³ZJEagles Comsemi)

Keywords:

Photonic integrated circuits,Photonics-Electronics integration,Packaging technology of photonic devices and circuits

We demonstrate a packaged optical transmitter with a GPPO interface on a micro-machined silicon interposer, achieving compact, high-speed connections between VCSEL and bias-T via flip-chip bonding, tested up to 25GBaud PAM4 with 14.6mW power consumption.