Presentation Information

[WG2-4]Micro-machined Silicon for VCSEL-Based Transmitter with Direct RF Interfaces

Jinsheng Xu1, ○Yueqi Zhao1, Zhenzhen Wang1, Chuanzhi Wang1, Jia Li1, Qian Zhang1, Qingwei Mo3, Chenhui Li1,2 (1.Research Center for Frontier Fundamental Studies, Zhejiang Lab, Hangzhou 310000, 2.College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, 3.ZJEagles Comsemi, Zhuji, 311800)

Keywords:

Photonic integrated circuits,Photonics-Electronics integration,Packaging technology of photonic devices and circuits

We demonstrate a packaged optical transmitter with a GPPO interface on a micro-machined silicon interposer, achieving compact, high-speed connections between VCSEL and bias-T via flip-chip bonding, tested up to 25GBaud PAM4 with 14.6mW power consumption.