Session Details
[WG2]Hybrid Integration I
Wed. Jul 2, 2025 11:00 AM - 12:30 PM JST
Wed. Jul 2, 2025 2:00 AM - 3:30 AM UTC
Wed. Jul 2, 2025 2:00 AM - 3:30 AM UTC
Room G (2F 206)
Presider: Naoko Inoue (Sumitomo Electric Industries)
[WG2-1]High Power EML Integrated with SOA
○Xing Dai1, Ngoc-Linh Tran1, Hélène Debrégeas1 (1.Almae Technologies)
[WG2-2]EML Assembled with Flip-Chip Technology on AlN Sub-mount Operating at 212.5 Gbps PAM4
○Kei Masuyama1, Mizuki Shirao1, Asami Uchiyama1, Takuma Fujta1, Yutaka Yoneda1, Kenichi Abe1, Chikara Watatani1, Shunto Katsumi1, Nobuo Ohata1 (1.Mitsubishi Electric Corporation)
[WG2-3]Mass-Production-friendly Design and Manufacturing for 100-Gb/s-PAM4-EML Using Single Butt-Joint Regrowth of InGaAsP-MQWs and optimized AR coating
○K H Huang1, Jian Fang1, Ming Yu1, Chen Gao1, Yanghuo Zhang1, Cedric Gao1, Kaifeng Yang1, Bill Liu1, Weizhong Sun1 (1.Zetta Semiconductor Co., Ltd.)
[WG2-4]Micro-machined Silicon for VCSEL-Based Transmitter with Direct RF Interfaces
Jinsheng Xu1, ○Yueqi Zhao1, Zhenzhen Wang1, Chuanzhi Wang1, Jia Li1, Qian Zhang1, Qingwei Mo3, Chenhui Li1,2 (1.Research Center for Frontier Fundamental Studies, Zhejiang Lab, Hangzhou 310000, 2.College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, 3.ZJEagles Comsemi, Zhuji, 311800)
[WG2-5]Tunable Laser Linewidth via Phase Wrapping in Optical Phase Random Walk Modulation
○Chen Zheng1, Tetsuya Kawanishi1,2 (1.Waseda University , 2.National Institute of Information and Communications Technology)