Session Details
[WG2]Hybrid Integration I
Wed. Jul 2, 2025 11:00 AM - 12:30 PM JST
Wed. Jul 2, 2025 2:00 AM - 3:30 AM UTC
Wed. Jul 2, 2025 2:00 AM - 3:30 AM UTC
Room G (2F 206)
Presider: Naoko Inoue (Sumitomo Electric Industries)
[WG2-1]High Power EML Integrated with SOA
○Xing Dai, Ngoc-Linh Tran, Hélène Debrégeas (Almae Technologies)
[WG2-2]EML Assembled with Flip-Chip Technology on AlN Sub-mount Operating at 212.5 Gbps PAM4
○Kei Masuyama, Mizuki Shirao, Asami Uchiyama, Takuma Fujita, Yutaka Yoneda, Kenichi Abe, Chikara Watatani, Shunto Katsumi, Nobuo Ohata (Mitsubishi Electric Corporation)
[WG2-3]Mass-Production-friendly Design and Manufacturing for 100-Gb/s-PAM4-EML Using Single Butt-Joint Regrowth of InGaAsP-MQWs and Optimized AR Coating
○K H Huang, Jian Fang, Ming Yu, Chen Gao, Yanghuo Zhang, Cedric Gao, Kaifeng Yang, Bill Liu, Weizhong Sun (Zetta Semiconductor Co., Ltd.)
[WG2-4]Micro-machined Silicon for VCSEL-Based Transmitter with Direct RF Interfaces
Jinsheng Xu1, ○Yueqi Zhao1, Zhenzhen Wang1, Chuanzhi Wang1, Jia Li1, Qian Zhang1, Qingwei Mo3, Chenhui Li1,2 (1Zhejiang Lab, 2Zhejiang Univ., 3ZJEagles Comsemi)
[WG2-5]Tunable Laser Linewidth via Phase Wrapping in Optical Phase Random Walk Modulation
○Chen Zheng1, Tetsuya Kawanishi1,2 (1Waseda Univ., 2National Institute of Information and Communications Technology)