Presentation Information
[P-30]Experiment-Based Modeling of Wafer-to-Wafer Bonding for 3D Integration
*Hyuga Ishii1, Takashi Shimura2, Ryota Ogata1, Hayato Kitagawa1, Taisuke Yamamoto1, Fumihiro Inoue1 (1. YOKOHAMA National University, 2. ESTECH Corp.)
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