Presentation Information

[Session_12-01]A Novel 2.5D Thermal Coupling Model for Device/Metal Reliability Applications

*Jyun-Yan Kuo1, Gary Lee1, Kasa Huang1, Jeffrey Tzeng1, Y.S. Lin1, S.H. Li1, Y.L. Chang1, H.P. Chien1, P.C. Hsu1, G.T. Lin1, W.C. Chang1, Eugene Chen1, C. C. Lai1, Tony Yu1, M.H. Hsieh1, Clement Huang1, K.Y. Su1, Jim Liang1, K.W. Su1, C.K. Lin1 (1. Taiwan Semiconductor Manufac. Company)

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