Session Details
[Session 12]Session 12: Thermal Transport and Electro-Thermal Modeling
Wed. Sep 30, 2026 1:00 PM - 2:20 PM JST
Wed. Sep 30, 2026 4:00 AM - 5:20 AM UTC
Wed. Sep 30, 2026 4:00 AM - 5:20 AM UTC
Room A2(3rd floor)
[Session_12-01]A Novel 2.5D Thermal Coupling Model for Device/Metal Reliability Applications
*Jyun-Yan Kuo1, Gary Lee1, Kasa Huang1, Jeffrey Tzeng1, Y.S. Lin1, S.H. Li1, Y.L. Chang1, H.P. Chien1, P.C. Hsu1, G.T. Lin1, W.C. Chang1, Eugene Chen1, C. C. Lai1, Tony Yu1, M.H. Hsieh1, Clement Huang1, K.Y. Su1, Jim Liang1, K.W. Su1, C.K. Lin1 (1. Taiwan Semiconductor Manufac. Company)
[Session_12-02]Joule heating and thermal transport in 2D materials for device applications
*Zlatan Aksamija1, Sylvester Makumi1, Aidan Belanger1 (1. Univ. of Utah)
[Session_12-03]Monte Carlo Modeling of Phonon Drag Effects on Thermoelectric Transport in Silicon Nanostructures with doping modulation
*Jerome Saint-Martin1,2, Mohammad Ghanem1, Raja Sen3, Jelena Sjakste3, Philippe Dollfus1 (1. Université Paris-Saclay, CNRS, Centre de Nanosciences et de Nanotechnologies, 2. Université Paris-Saclay, ENS Paris-Saclay, CNRS, SATIE, 3. Laboratoire des Solides Irradiés, CEA-DRF-IRAMIS, École Polytechnique)
[Session_12-04]Three-Dimensional Monte Carlo Simulation of Phonon Transport in Amorphous IGZO Thin-Film Transistors
*Chenglin Ye1, Zhaoxing Yan1, Haotong Zhu1, Ligong Zhang1, Yuanzhao Hu1, Xiaoyan Liu1 (1. Peking Univ.)
